Technical information

Introducing technical information and product topics of Kyocera electronic component products.

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5G Ethernet UWB Aluminum wire Prevent cracks Noise resistance Matching Low Thermal Resistance Improve Workability Cooling Base station Rapid charging Space-Saving Product Lineup Trivia Automobile Telecommunication Devices Long life time Waterproof High Capacitance High Heat Dissipation

Product Lineup Expansion: Small-Size and Reliable SAW Duplexer

Introducing the expansion of Kyocera’s SD16 Series of compact SAW duplexers for smartphones and communication devices.

Space-Saving
Telecommunication Devices
Product Lineup

Compact High-Capacity Capacitors for the Automotive Market

Kyocera is expanding our product lineup by developing new products in the field of low-voltage compact high-capacity capacitors, which offer high performance and high reliability. Kyocera will continue to actively introduce product variations for the in-vehicle market.

Automobile
High Capacitance
Product Lineup
Space-Saving

0.3mm Pitch/Low-Profile/Space-Saving/High Robustness - Board to Board Connectors

Introducing 0.3mm pitch board to board connectors for smartphones and wearable devices.

Space-Saving
Rapid charging
Telecommunication Devices

New Small SAW Quadplexer Products for Telecommunication Devices

Kyocera's new unique SAW technology provides high performance, high-power resistance, and the industry’s smallest* 2.0x1.6mm size (versus conventional 2.5x2.0 mm size).*For SAW Quadplexers, as of June 2023. Kyocera research.

Telecommunication Devices
Space-Saving

SiC Power Module and GaN Power Module

Introducing compact and ultra-efficient power modules developed based on SiC technology and proprietary GaN technology.

Automobile
Space-Saving
Cooling

EIA 0201 Size MLCCs with the Industry's Highest* Capacitance of 10μF

Kyocera has developed a new MLCC with EIA 0201 size (0.6mm x 0.3mm) and the industry's highest^* capacitance of 10μF. *Among MLCCs in the 0201 case size (KYOCERA research, March 2023)

Space-Saving
High Capacitance
Telecommunication Devices

Ultra-Small Crystal Units CX1008SB Series

The increasing functionality of communication terminals has led to an increase in the mounting density of electronic devices and a reduction in the mounting area, leading to demand for smaller mounting components. In this market context, Kyocera has developed our new ultra-small crystal unit CX1008SB Series available for mass production.

Space-Saving
Telecommunication Devices
5G

Low-Profile, Space-Saving Connectors

Introducing low-profile, space-saving FPC/FFC connectors and board to board connectors that are widely used for internal connection of laptop computers.

Space-Saving
Improve Workability
Product Lineup

Introducing Kyocera's Small and Thin MLCCs for Semiconductor Applications and Operable at 105℃

Kyocera has developed a lineup of small and thin products operable at the high-demand 105℃ temperature limit.

High Capacitance
Space-Saving
Product Lineup

NEW Compact and Lightweight IGBT

Introducing Kyocera’s new small IGBT/FRD modules for inverter and servo brake circuits.

Space-Saving

Introduction of Small and Low-Profile Connectors

Introducing two space-saving, low-profile connectors: an FPC narrow-pitch connector and a board to board connector, which are widely used for internal connections in wearable devices.

Space-Saving
Telecommunication Devices
Product Lineup

0.9mm Pitch Two-Piece IDC Wire to Board Connector System "8041 Series"

Introducing the "8041 Series" 0.9mm pitch Insulation Displacement Contacts wire to board connectors by Kyocera featuring a low-profile, space-savings, and two-point design.

Improve Workability
Telecommunication Devices
Space-Saving

Miniaturized and Lightweight SAW Devices for Base Stations

Introducing Kyocera's extensive lineup of highly reliable, compact, and lightweight SAW devices for downsizing and lightweight base stations.

Base station
Space-Saving
Product Lineup

Power Semiconductor Devices: Low-Profile LPTO-263

Introducing Kyocera’s LPTO-263 power semiconductor devices, which have a lower height and higher heat dissipation than existing products (TO-263 package outline).