GCH30A10 2.Production

Schottky barrier diodes are not PN junctions, but diodes that utilize potential barriers between semiconductor materials and metal electrodes, e.g., Schottky barrier. They have lower forward voltage (VF) characteristics and shorter reverse recovery time (trr) than typical PN junction diodes, making them suitable for switching operation. However, the reverse current (IR) is larger than that of conventional PN diodes.

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Application

Power supplies
Industrial Equipment

Specifications

Series	TG
Outline	TO-220
V_RRM [V]	100V
I_o [A]	30.0A
I_FSM [A]	250.0A
I_R [mA]	2.000mA
V_FM [V]	0.88V
@IFM [A]	15.0A
Operating Temperature Range	-40℃ ~ 150℃
R_th(j-c) [°C/W]	1.50°C/W
Connection type	B
Packaging style	Tube
Quantity per Package	50
Weight	1.900g

Remarks

Low-IR type

Packaging Specifications

Packaging style	Tube
Quantity per Package	50
Weight	1.900g

Engineering Documents

Product Specification / Drawing

GCH30A10-file.pdf (802.31KB)

Environmental data

RoHS Compliance	Yes

RoHS_GCH30A10.pdf (458.79KB)

TSCA_GCH30A10.pdf (47.61KB)

FAQ

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All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.

MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)

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Related Glossary

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Diodes utilizing potential barrier (schottky barrier) formed at a junction between metal electrode and semiconductor.

[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.

A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.