PCFMB100W12 2.Production

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Kyocera offers power modules adopting diverse packaging technologies in industrial fields requiring highly-reliable equipment and for the in-vehicle equipment market.
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Specifications

Series PCFMB
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Outline E-74
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VCES [V] 1200V
IC [A] 100A
Vce(sat.)(typ.) [V] 1.50V
ton (typ.) [µs] 0.170µs
toff (typ.) [µs] 0.690µs
Diode IF [A] 100A
Diode VF (typ.) [V] 2.00V
Diode trr (typ.) [µs] 0.170µs
IGBT Rthj-c (Max.) [°C/W] 0.310°C/W
FRD Rthj-c (Max.) [°C/W] 0.720°C/W
Safety Standard UL
Weight 150.000g

Packaging Specifications

Weight 150.000g

Engineering Documents

Product Specification / Drawing
PCFMB100W12-file.pdf (228.97KB)

Environmental data

RoHS Compliance Yes

FAQ

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All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.

MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)

The followings are recommended storage conditions for our power device products:

[Before unpacking]
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH

Related Glossary

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Abbreviation of Insulated Gate Bipolar Transistor. A type of three-terminal power semiconductor device, with an insulated gate which controls the current flowing through the device. An IGBT features the voltage-driven characteristics of MOSFETs in addition to the high-current capability of bipolar transistors.