P2H30QH10 2.Production

Kyocera offers power modules adopting diverse packaging technologies in industrial fields requiring highly-reliable equipment and for the in-vehicle equipment market.

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Distributor Inventory

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Distributor	Buy

Please check the website of each agency for the latest information.

Application

Power supplies
Industrial equipment

Specifications

Series	SBD Modules
Circuit
Outline	E-38
V_RRM [V]	100V
I_o [A]	30.0A
I_FSM [A]	150.0A
V_FM (Max.) [V]	1.00V
Operating Temperature Range	-40℃ ~ 150℃
Weight	35.000g

Packaging Specifications

Weight	35.000g

Engineering Documents

Product Specification / Drawing

P2H30QH10-file.pdf (455.64KB)

Environmental data

RoHS Compliance	Yes

FAQ

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All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.

MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)

The followings are recommended storage conditions for our power device products:

[Before unpacking]
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH

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Related Glossary

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Diodes utilizing potential barrier (schottky barrier) formed at a junction between metal electrode and semiconductor.

[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.

[Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.

Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.