245806024112829+ 2.Production

The 5806 Series are Board to Board Connectors with a fine pitch of 0.4mm and an ultra-low stacking height of 0.6mm. These products feature the width of 1.9mm on the short side, which contributes to downsizing in small electronic equipment.
Suitable for consumer devices such as smartphones, tablet PCs, wearable devices, laptops, audio equipment and game machines.

Features
- An original locking structure is adopted for mating, which generates a firm 'click' sound and enhances the retention force when connectors are removed despite the ultra-low profile.
- A pinching structure (two-point contact design) is adopted to enhance resistance to vibrations and drop shocks. In addition, the plug connector features a structure which removes foreign matter with concentrated load (wiping effect), thus realizing high contact reliability.
Application
- Smartphone/Tablet PC
- Wearable Device
- Laptop
- Audio equipment
- Gaming Equipment
Specifications
Pitch | 0.400mm |
---|---|
Connection Style |
Parallel Connection |
Stacking Height |
0.60mm |
Width | 1.90mm |
No. of Positions | 24 |
Operating Temperature Range |
-40℃ ~ 85℃
|
Rated Current(signal) | DC 0.3A/Contact |
Rated Voltage | DC 60V/Contact |
Withstanding Voltage | AC 250Vrms、1min. |
Shape | Receptacle |
Metal Tab | With |
Boss | Without |
Vacuum item | Without |
Packaging style | Reel |
Quantity per Package | 5000 |
Packing Specification |
|
Packaging Specifications
Packaging style | Reel |
---|---|
Quantity per Package | 5000 |
Packing Specification |
|
Engineering Documents
Catalog
2D Drawing
Product Specification
Evaluation Test Report
Test Report SearchInstruction Manual
Environmental data
RoHS Compliance | Yes |
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FAQ
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Related Glossary
View AllTo combine a connector to a compatible part for the purposes of transferring electricity.
Distance between the two surfaces that the connectors are mounted on.
Spacing between contacts. Center-line spacing of adjacent contacts.
Number of terminals/leads/circuits/contacts/ways contained in a connector.
The action in which a connector contact rubs the mating surface of another contact eliminating oxides/foreign substances adhering to the surface.