- Low profile design achieved with advanced thinning and lamination technologies can be mounted in between BGA.
- Small, high-CV product deployment for processor and module applications.
- Capable of handling temperatures up to 105℃ required for high-performance ICs.
Processor, Module and Embedded Applications
|Thickness (MAX.)||Size Code (EIA)||Capacitance||Temperature Characteristics||2.5V||4V||6.3V|
The products in yellow shades are mass production items.
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Introducing the Industry Leading Miniature Hi-Q MLCC
Kyocera has developed an industry leading miniature Hi-Q MLCC using copper (Cu) as the internal electrode to deliver superior Q factor.