Features
- Low profile design achieved with advanced thinning and lamination technologies can be mounted in between BGA.
- Small, high-CV product deployment for processor and module applications.
- Capable of handling temperatures up to 105℃ required for high-performance ICs.
Data is based on research by Kyocera.
Applications
Processor, Module and Embedded Applications
Product Lineup
| Thickness (MAX.) | Size Code (EIA) | Capacitance | Temperature Characteristics | 2.5V | 4V | 6.3V |
|---|---|---|---|---|---|---|
| 0.22mm | 0402 | 2.2μF | X5R | NEW | ||
| X6T | NEW | |||||
| 1μF | X5R | |||||
| X6T | Product Search | |||||
| 0201 | 1μF | X5R | NEW | |||
| X6T | NEW |
The products in yellow shades are mass production items.
Contact & Support
