- Low profile design achieved with advanced thinning and lamination technologies can be mounted in between BGA.
Kyocera has a lineup that starts from under 0.5mm in height, and there are also thin products under 0.22mm that can be mounted in the gaps between BGA.
- Small, high-CV product deployment for processor and module applications.
- Capable of handling temperatures up to 105℃ required for high-performance ICs.
What is BGA?
BGA is a type of semiconductor package consisting of a grid of small ball-shaped solders.
It is short for Ball Grid Array.
SoC, Memory, Small Modules, Processor, Module and Embedded Applications
What is SoC?
SoC is an integrated circuit product that is designed to function as one integrated system by integrating processor cores, microcomputers, and other functions for application purposes.
It is short for System on a Chip.
|Thickness (Max.)||Size Code (EIA)||0.22μF||1μF||2.2μF||10μF|
|0402||X6S 6.3V||X6T 4V
The products in yellow shades are mass production items.
Technical information View All
EIA 0201 Size MLCCs with the Industry's Highest* Capacitance of 10μF
Kyocera has developed a new MLCC with EIA 0201 size (0.6mm x 0.3mm) and the industry's highest* capacitance of 10μF.…
Compact High-Capacity Capacitors for the Automotive Market
Kyocera is expanding our product lineup by developing new products in the field of low-voltage compact high-capacity capacitors, which offer high…