Features

- Low profile design achieved with advanced thinning and lamination technologies can be mounted in between BGA.
- Small, high-CV product deployment for processor and module applications.
- Capable of handling temperatures up to 105℃ required for high-performance ICs.



Data is based on research by Kyocera.
Applications
Processor, Module and Embedded Applications
Product Lineup
Thickness (MAX.) | Size Code (EIA) | Capacitance | Temperature Characteristics | 2.5V | 4V | 6.3V |
---|---|---|---|---|---|---|
0.22mm | 0402 | 2.2μF | X5R | NEW | ||
X6T | NEW | |||||
1μF | X5R | |||||
X6T | Product Search | |||||
0201 | 1μF | X5R | NEW | |||
X6T | NEW |
The products in yellow shades are mass production items.