FCQS20A065 2.Production
Schottky barrier diodes are not PN junctions, but diodes that utilize potential barriers between semiconductor materials and metal electrodes, e.g., Schottky barrier. They have lower forward voltage (VF) characteristics and shorter reverse recovery time (trr) than typical PN junction diodes, making them suitable for switching operation. However, the reverse current (IR) is larger than that of conventional PN diodes.
Application
- Power supplies
- Industrial Equipment
Specifications
Series | TF |
---|---|
Outline |
TO-220 Full-Mold |
VRRM [V] | 65V |
Io [A] | 20.0A |
IFSM [A] | 180.0A |
IR [mA] | 1.000mA |
VFM [V] | 0.63V |
@IFM [A] | 10.0A |
Operating Temperature Range | -40℃ ~ 150℃ |
Rth(j-c) [°C/W] | 2.00°C/W |
Connection type | E |
Packaging style | Tube |
Quantity per Package | 50 |
Weight | 1.750g |
Packaging Specifications
Packaging style | Tube |
---|---|
Quantity per Package | 50 |
Weight | 1.750g |
Engineering Documents
Product Specification / Drawing
FCQS20A065-file.pdf (1706.97KB)FAQ
View AllAll values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.
MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)
The followings are recommended storage conditions for our power device products:
[Before unpacking]
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH
Related Glossary
View AllDiodes utilizing potential barrier (schottky barrier) formed at a junction between metal electrode and semiconductor.
Related Products Discretes Schottky Barrier Diodes(SBD) FRD/SBD Modules
[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.
A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.
[Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.
Range of ambient temperature while not operating.