245861012004829+ 2.Production

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The 5861 Series are space-saving Board to Board Connectors featuring a fine pitch of 0.35mm, stacking height of 0.6mm (between boards) and a width of 1.95mm. With the metals covering both ends, the connector, with narrow pitches and low profile though, realizes the structurally high robustness and smooth guiding function for mating to prevent breakage of the insulator housing and contact caused by misaligned mating. The metals at both ends of which rated current is 5.0A/metal tab enable to carry a large current.

Recommended applications: Small electronics and IoT products such as smartphones, wearable devices, and audio devices etc.

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Features

  • A pinching structure (two-point contact design), which is highly resistant to vibration and drop shocks, has been adopted for the contact structure. Furthermore, the plug contacts have an original structure featuring a wiping effect which eliminates foreign matter with concentrated load, thus realizing high contact reliability.

Application

  • Smartphone/Tablet PC
  • Wearable device
  • Laptop
  • Audio equipment
  • Game machine

Specifications

Pitch 0.350mm
Connection Style Parallel Connection
Stacking Height 0.60mm
Width 1.95mm
No. of Positions 12
Operating Temperature Range -55℃ ~ 85℃
Rated Current(signal) DC 0.5A/Contact
Rated Current(power) DC 5.0A/metal tab
Rated Voltage DC 60V/Contact
Withstanding Voltage AC 250Vrms、1min.
Shape Receptacle
Metal Tab With
Boss Without
Vacuum item Without
Packaging style Reel
Quantity per Package 15000
Packing Specification 305031057.pdf (130.87KB)

Packaging Specifications

Packaging style Reel
Quantity per Package 15000
Packing Specification 305031057.pdf (130.87KB)

FAQ

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Related Glossary

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To combine a connector to a compatible part for the purposes of transferring electricity.

Distance between the two surfaces that the connectors are mounted on.

Spacing between contacts. Center-line spacing of adjacent contacts.

Number of terminals/leads/circuits/contacts/ways contained in a connector.

The action in which a connector contact rubs the mating surface of another contact eliminating oxides/foreign substances adhering to the surface.