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Contact usVR Headset Exploded View
The Kyocera electronic components used in VR headset are shown in the exploded view.
(1) Board to Board Connectors 
Series | Pitch | Stacking Height |
|---|---|---|
0.35mm | 0.6mm | |
0.35mm | 0.8mm | |
0.35mm | 0.8mm | |
0.35mm | 0.8mm | |
0.35mm | 0.7mm | |
0.4mm | 0.6mm | |
0.4mm | 0.9 / 1.5 / 2.0mm |
(2) FPC/FFC Connectors 
Series | Pitch | Lock Type |
|---|---|---|
0.2mm | Front Flip | |
0.3mm | Back Flip | |
0.3mm | Front Flip | |
0.5mm | Back Flip | |
0.5mm | Back Flip | |
0.5mm | Back Flip | |
0.5mm | Front Flip | |
0.5mm | Front Flip | |
0.5mm | One-action | |
0.5mm | Non-ZIF | |
0.5mm | Flip Lock |
(3) Crystal Devices 
Crystal Units
Series | Size | Applications | Frequency (MHz) |
|---|---|---|---|
1008 | Wi-Fi / BluetoothⓇ | 76.8, 79.96 | |
1210 | UWB | 38.4 | |
1210 | AP | ||
1210 | Wi-Fi / BluetoothⓇ | ||
1612 | Wi-Fi / BluetoothⓇ |
Clock Oscillators (SPXO)
Series | Size | Applications | Frequency (MHz) |
|---|---|---|---|
1210 | AP | 19.2 | |
1210 | FPGA | 100 | |
1612 | AP | 19.2 | |
1612 | FPGA | 100 | |
1612 | GNSS / GPS | ||
1612 | UWB | ||
2016 | GNSS / GPS |
(4) Antennas 
Series | Size | Applications |
|---|---|---|
1.00 x 0.55 x 0.40mm | UWB | |
1.00 x 0.55 x 0.40mm | Wi-Fi / BluetoothⓇ |
(5) Wire to Board Connectors 
Series | Pitch | Stacking Height |
|---|---|---|
0.9mm | 0.9mm | |
1.0mm | 1.4mm | |
1.27mm | 1.9 to 3.61mm |
(6) Polymer Capacitors 
Series | Capacitance |
|---|---|
1.0µF to 47µF | |
2.2µF to 330µF | |
4.7µF to 1500µF |
(7) MLCC 
Part Number | Size | Capacitance | Rated Voltage |
|---|---|---|---|
EIA 0402 | 1µF | 10V | |
EIA 0402 | 10µF | 10V | |
EIA 0402 | 22µF | 6.3V |
(8) SAW Devices 
Part Number | Size | Operating Temperature Range |
|---|---|---|
1.1×0.9mm | -20℃ to 85℃ | |
1.1×0.9mm | -40℃ to 85℃ |
BluetoothⓇ is a trademark or registered trademark of Bluetooth SIG, Inc.
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