Electronic Components & Devices

Power Semiconductor Devices

Power Semiconductor Devices: Low-Profile LPTO-263

Introducing Kyocera’s LPTO-263 power semiconductor devices, which have a lower height and higher heat dissipation than existing products (TO-263 package outline).

Features

Low Profile: Approximately 60% lower thickness than the TO-263 package outline.
High Heat Dissipation: Chip is connected to the external terminal by a clip to increase the area of the heat sink on the rear.
Compatibility: Similar design as the TO-263 package outline.
Avalanche-guaranteed SBDs are also available in the lineup.

Size Comparison with the TO-263

By reducing the height, the thickness has been decreased by approximately 60% compared to the TO-263.

Comparison of size

Comparison of Heat Generation with the TO-263

In 10A/30V SBD

Heat dissipation has been improved by enlarging the terminal surface and applying internal soldering.

comparison of heat generation

In 30A/30V SBD

Compared to the TO-263, the temperature rise is reduced by approximately 35 to 50%, and heat dissipation is also improved.

Data is based on research by Kyocera.

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Product List

Type	Part Number	I_O	V_RRM	V_FM@I_FM Tj=25℃	I_RM@V_RRM Tj=25℃	Trr@I_FM Tj=25℃	Guaranteed Junction Temperature	AEC-Q101
FRD	UCF10B40	10A	400V	1.35V	20μA	45ns	-40℃ to +150℃	Yes
	UCF20B40	20A	400V	1.30V	20μA	45ns	-55℃ to +175℃	Yes
	UCU20D30	20A	300V	1.30V	25μA	33ns	-55℃ to +175℃	-
SBD	UCHS10A065	10A	65V	0.65V	0.1mA	-	-40℃ to +150℃	-
	UCHS10A08	10A	80V	0.69V	0.1mA	-		-
	UCHS10A12	10A	120V	0.84V	0.1mA	-		-
	UCHS20A08	20A	80V	0.71V	0.15mA	-		Yes
	UCHS20A12	20A	120V	0.87V	0.1mA	-		-
	UCHS30A08	30A	80V	0.79V	0.1mA	-		-
	UCHS30A12	30A	120V	0.90V	0.1mA	-		-
	UCQ30A03	30A	30V	0.50V	1.5mA	-		-
	UCQS10A065	10A	65V	0.61V	0.4mA	-		-
	UCQS20A045	20A	45V	0.54V	0.6mA	-		Yes
	UCQS30A045	30A	45V	0.55V	1.0mA	-		-
SBD (Avalanche Guaranteed SBD)	UCHD30A09	30A	90V	0.79V	0.1mA	195W @PRRSM		Yes

Applications

Power supplies, industrial equipment

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Power Semiconductor Devices Top Page

Related Keywords

# Space-Saving # High Heat Dissipation # Product Lineup # Low Thermal Resistance

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