Introducing the Band 2 Compact SAW Duplexer

Introducing Kyocera’s " Band2 Compact SAW Duplexer", the industry's smallest* (1.6 x 1.2 mm) chip size package (CSP) with improved adjacent band attenuation.

Accelerated by this technology, it is expected that the market for communication devices, including smartphones and wearable devices, will continue to grow.

*As of August 2023. Kyocera research

Overview

Achieving high-quality wireless communications

Kyocera will continue to contribute to the development of high-quality wireless communications with our unique SAW technology.

Features

Kyocera's unique TC-SAW technology achieves high performance
Low insertion loss
High damping characteristics
High isolation
High power durability for 5G
　DFT-s-OFDM: 30dBm
　CP-OFDM: 28.5dBm
The industry's smallest size^*
Ultra-compact size of 1.6 x 1.2 mm, smaller and lighter than the conventional product size (1.8 x 1.4 mm).
High performance and reliability

Learn more about Kyocera's unique TC-SAW technology.

*Among CSP (As of August 2023. Kyocera research)

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Specifications

Part Number

New Product：SD16-1880R8UUA1

Electrical Characteristics

Items			Unit	Kyocera
Items			Unit	min.	typ.	max.
Tx to Ant	Loss		dB	-	1.8	2.5
Tx to Ant	Attenuation	Rx-Band	dB	40	53	-
Ant to Rx	Loss		dB	-	2.1	3.0
Ant to Rx	Attenuation	Tx-Band	dB	40	50	-
Tx to Rx	Isolation	Rx-Band	dB	51	57	-
Tx to Rx	Isolation	Tx-Band	dB	55	60	-

Typical Curve Data

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Curve Data

Data is based on research by Kyocera.

Applications

Smartphones, Communication devices, etc.

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Related Keywords

# Space-Saving # Telecommunication Devices # 5G

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