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SiC Power Module and GaN Power Module

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Introducing compact and ultra-efficient power modules developed based on SiC technology and proprietary GaN technology.

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SiC Power Module

To meet the needs of the rapidly expanding market for electrical and hybrid vehicle inverters, KYOCERA AVX (Salzburg) has developed a compact, ultra-efficient power module based on the latest SiC technology. Due to its high power density, this module can be used in many other applications where high switching speeds are required.

 

Products from this area are also known by the following keywords:
Half-bridge module, B6 full bridge, Si / SiC power module

 

Our controls support the focal areas of future mobility:
Electromobility, renewable energy, charging infrastructure, H2 applications / drives, fuel cell vehicles

Features

  • Small design package
  • High power density
  • Integrated metal baseplate available for cooling
  • Various performance classes available
  • Qualified according to ECPE AGQ 324 (planned)
  • Low stray inductances
  • Scalable switching architecture to optimize cost
  • Available in custom Half-Bridge & B6 Bridge configurations

 

Application-Specific Data

Nom. Voltage 470V 810V
Max. Breakdown Voltage 750V 1200V
Max. Current 500A 500A
Temperature -40℃ to +175℃
SiC power module

Typical Applications

  • Inverters (E-Motor, DC-DC, Solar, etc)
  • EV charging stations
  • Motor drives
Electromobility

GaN Power Module

To meet the needs of the rapidly expanding market for electrical and hybrid vehicle inverters, KYOCERA AVX (Salzburg) has developed a compact, ultra-efficient power module based on the latest GaN technology. Due to its high power density, this module can be used in many other applications where high switching speeds are required.

 

Products from this area are also known by the following keywords:
Half-bridge module, B6 full bridge

 

Our controls support the focal areas of future mobility:
Electromobility, renewable energy, charging infrastructure, H2 applications / drives, fuel cell vehicles

Features

  • Small design package
  • High power density
  • Integrated metal baseplate available for cooling
  • Various performance classes available
  • Qualified according to ECPE AGQ 324 (planned)
  • Low stray inductances
  • Scalable switching architecture to optimize cost
  • Available in custom Half-Bridge & B6 Bridge configurations

 

Application-Specific Data

Nom. Voltage 470V
Max. Breakdown Voltage 650V
Max. Current 500A
Temperature -40℃ to +175℃
GaN power module

Typical Applications

  • Electromobility
  • Inverters (E-Motor, DC-DC, Solar, etc)
  • EV charging stations
  • Motor drives
  • On-board chargers
Charging stations