296409204002856+ 4.생산 중지품

6409시리즈는 JEDEC MO-268규격과 JEDEC MO-224규격에 준거한 DDR3 및 DDR2 S.O.DIMM카드용 커넥터입니다. 0.6mm피치, SMT, 스트레이트(수직접속)타입으로 204핀(1.5V／DDR3용)과 200핀(1.8V／DDR2용)을 준비하였습니다. 메모리카드기판이 확실히 삽입되므로 레버가 올라가 양사이드의 암으로 카드기판을 고정하는 구조로 불완전삽입을 방지. 복합기로부터 각종프린터, 스캐너, POS시스템단말 등, 폭 넓게 사용하실 수 있습니다.

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Distributor	Part Number	Uploaded	Country / Region	Quantity	Buy

Distributor	Part Number	Uploaded	Country / Region	Quantity
Distributor	Buy

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사양

준거규격	JEDEC MO224
접속형태	Vertical
타입	Lever closed
핀간격 [mm]	0.600mm
기판실장방법	SMT
극수	204
사용온도범위	-55℃ ~ 85℃
정격전류 (신호핀）	DC 0.3A/Contact
정격전압	DC 25V/Contact
내전압	AC 250Vrms、1min.
포장	Tray
Quantity per Package	26
포장규격표	30503854.pdf (238.56KB)

포장 사양

포장	Tray
Quantity per Package	26
포장규격표	30503854.pdf (238.56KB)

엔지니어링 문서

Environmental data

RoHS 규제 대응	Yes

RoHS_6409.pdf (383.74KB)

REACH_6409.pdf (41.64KB)

TSCA_6409.pdf (73.58KB)

FAQ

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Related Glossary

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Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.

Protrusions made by an embossing work. On connectors, a cylindrical protrusion(s) formed on an insulator housing for positioning the connector on a board. Also known as pegs.

An insulating body or generic name for insulating materials constituting the outer shell of a connector that holds or accommodates contacts or post pins. It is also called a housing or mold.

Terminals, leads or pins contained in connectors, or also contacting part of the terminal/lead/pin. Metal parts or metallic portions responsible for conducting electricity when connectors are mated or connected. There are various kinds of contacts, such as tuning forks and bellows.