전자부품 용어집

SAW 제품

The reduced level of unnecessary signals.

Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.

Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a disturbance of electromagnetic origin.

Abbreviation of Frequency Division Duplex. The duplex which realizes simultaneous communication of Tx and Rx　by using different frequency bands.

The opposition to current flow in a circuit, including resistance, inductance, and capacitance.

The loss of signal power resulting from the insertion of a device in a transmission line or optical fiber.

Signal division between Tx (Transmit) and Rx (Receive).

Electronic component which amplifies low-power signals without degrading its signal-to-noise ratio.

Technology which prints fine patterns on a wafer by certain exposure treatments during development. Features high accuracy and mass production capability.

Electronic component which amplifies a signal to achieve a higher frequency for transmission.

A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).

Gap between the highest point and lowest point of loss within a passband.