846407001000804+ 4.생산 중지품


사양
준거규격 | Mini PCI Express |
---|---|
타입 | STUD |
기판실장방법 | SMT |
극수 | 0 |
사용온도범위 |
-40℃ ~ 85℃
|
포장 | Reel |
Quantity per Package | 2000 |
포장규격표 |
|
포장 사양
포장 | Reel |
---|---|
Quantity per Package | 2000 |
포장규격표 |
|
엔지니어링 문서
카탈로그
평가시험보고서(Test Report)
평가시험보고서 검색FAQ
일람Please apply using the form below.
To Access the Test Report Search Page
Related Glossary
일람Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.
Protrusions made by an embossing work. On connectors, a cylindrical protrusion(s) formed on an insulator housing for positioning the connector on a board. Also known as pegs.
An insulating body or generic name for insulating materials constituting the outer shell of a connector that holds or accommodates contacts or post pins. It is also called a housing or mold.
Terminals, leads or pins contained in connectors, or also contacting part of the terminal/lead/pin. Metal parts or metallic portions responsible for conducting electricity when connectors are mated or connected. There are various kinds of contacts, such as tuning forks and bellows.