SAW 제품
Please refer to the specification sheet for each product.
It is 50 volts or more. (Cumulative failure rate: 10%)
The MSL is 3 for all Kyocera SAW device products. (Needed damp proof packing)
No, they are not usable. Even in the case of resin molding method, please contact us beforehand.
When soldering, please use a spot heater under the following conditions:
・Preheating: 150℃ +/- 10℃ for 60 seconds at minimum
・Warm air temperature: 280℃ +/- 10℃ for 30 seconds at maximum
We recommend up to three times.
- Dry the packed and taped products one time for 10±1 hours at 60±2℃ and 10% RH or less.
- Put the products in a heat-resistant container and dry it one time for 10±1 hours at 60±2℃ and 10% RH or less, for 8±1 hours at 70±2℃ and 10% RH or less, or for 6±1 hours at 80±2℃ and 10% RH or less.