PGH75N16 2.양산품

Kyocera offers power modules adopting diverse packaging technologies in industrial fields requiring highly-reliable equipment and for the in-vehicle equipment market.

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애플리케이션

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사양

시리즈	PGH
Circuit
Outline	E-68
V_RMM V_DRM [V]	1600V
I_o [A]	75.0A
I_TSM [A]	1200A
I_GT [mA]	100mA
V_GT [V]	2.5V
사용온도범위	-40℃ ~ 150℃
Safety Standard	UL
포장	Bulk
제품 질량	225.000g

포장 사양

포장	Bulk
제품 질량	225.000g

엔지니어링 문서

규격표 / 도면

PGH75N16-file.pdf (2693.25KB)

Environmental data

RoHS 규제 대응	Yes

FAQ

일람

All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.

MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)

The followings are recommended storage conditions for our power device products:

[Before unpacking]
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH

Related Glossary

일람

A type of three-terminal power semiconductor device that conducts high current when the gate receives a current trigger.

Related Products　Power Semiconductor device

An electrode through which a current flows into a polarized electrical device.

[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.

Minimum gate voltage required to turn on.

Minimum gate current required to turn on.