MA10EA06 2.양산품

Schottky barrier diodes are not PN junctions, but diodes that utilize potential barriers between semiconductor materials and metal electrodes, e.g., Schottky barrier. They have lower forward voltage (VF) characteristics and shorter reverse recovery time (trr) than typical PN junction diodes, making them suitable for switching operation. However, the reverse current (IR) is larger than that of conventional PN diodes.

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애플리케이션

전원 장치
산업기기
자동차 (인포테인먼트)
자동차 (운전 / 안전 장비)

사양

시리즈	MA
Outline	DO-221BC
V_RRM [V]	60V
I_o [A]	10.0A
I_FSM [A]	200.0A
I_R [mA]	0.600mA
V_FM [V]	0.56V
@IFM [A]	10.0A
사용온도범위	-55℃ ~ 150℃
R_th(j-c) [°C/W]	4 (j-l)°C/W
포장	Reel
Quantity per Package	3000
제품 질량	0.040g

포장 사양

포장	Reel
Quantity per Package	3000
제품 질량	0.040g

엔지니어링 문서

Environmental data

RoHS 규제 대응	Yes

RoHS_MA10EA06.pdf (458.79KB)

TSCA_MA10EA06.pdf (47.61KB)

FAQ

일람

All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.

MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)

Related Glossary

일람

Diodes utilizing potential barrier (schottky barrier) formed at a junction between metal electrode and semiconductor.

[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.

[Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.

Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.