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규격표 / 도면30GQA04-file.pdf (2257.83KB)
|사용온도범위||-40℃ ~ 150℃|
|Rth(j-c) [°C/W]||13.0 (j-l)°C/W|
When connecting one-chip type elements such as axial type products or miniature SMD products, 1:0.6 (62.5% : 37.5%) would be an approx. value as a general theory. Since two-chip in an element such as represented by the TO-220 type is a package and has good heat balance, the good flow dividing ratio would be 1:0.8 (55.6% : 44.4%).
All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.
The followings are recommended storage conditions for our power device products:
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH
A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.
[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.
[Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.
Range of ambient temperature while not operating.