UCF10B40 2.양산품
애플리케이션
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사양
시리즈 | TU |
---|---|
AEC-Q |
AEC-Q101 |
Outline |
TO-263LP |
VRRM [V] | 400V |
Io [A] | 10.0A |
IFSM [A] | 80.0A |
IR [mA] | 0.020mA |
VFM [V] | 1.35V |
trr [ns] | 45.0ns |
사용온도범위 | -40℃ ~ 150℃ |
Rth(j-c) [°C/W] | 3.00°C/W |
Connection type | E |
포장 | Reel |
Quantity per Package | 2000 |
제품 질량 | 0.590g |
포장 사양
포장 | Reel |
---|---|
Quantity per Package | 2000 |
제품 질량 | 0.590g |
엔지니어링 문서
규격표 / 도면
UCF10B40-file.pdf (918.63KB)3D Models
STEP_LPTO263.zip (52.73KB)FAQ
일람It would be difficult to secure voltage balance in two high-speed FRDs connected in series directly (Connection where voltage protection is not coordinated). Especially for the commutation surge voltage in high-speed switching, shared voltage varies largely due to difference in reverse recovery characteristics of the two devices. Thermal influence of other components and exoergic environment also affect the difference largely. Therefore, it is possible that 100% of voltage would be applied to one device.
In order to suppress such differences, it is necessary to add a voltage dividing capacitor to each device to share the differences. There is no specified capacitance value for such voltage dividing capacitors because the value varies depending on the operating conditions. It is necessary to make sure whether the voltage can be surely shared by the capacitors so that their capacitances could be between several tens pF and several hundreds pF.
Ripping can be suppressed by these capacitors. In order to divide the steady reverse voltage in half, resistors in parallel are also required.
That is to say, adding capacitors or resistors is an only way to balance voltage. The point is that adding a resistor or a capacitor is an only way to get the voltage balance.
When connecting one-chip type elements such as axial type products or miniature SMD products, 1:0.6 (62.5% : 37.5%) would be an approx. value as a general theory. Since two-chip in an element such as represented by the TO-220 type is a package and has good heat balance, the good flow dividing ratio would be 1:0.8 (55.6% : 44.4%).
All values except for the graph of Junction capacitance vs. Reverse Voltage of SBD products are maximum values, which are guaranteed. Graphs of Junction capacitance vs. Reverse Voltage show typical values (TYP). The curves of the average forward current rating are formed by connecting points where the junction temperature reaches 150℃.
MSL standards are defined for SMDs to be reflow-soldered, and all Kyocera products are MSL: 1. (No need for damp proof packing)
The followings are recommended storage conditions for our power device products:
[Before unpacking]
Storage temperature: 5 to 35℃ / Storage humidity: 45 to 70% RH
Related Glossary
일람PN type junction rectifying device. Diodes suitable for rectifying high frequency power supply with short reverse recovery time (trr).
Related Products Discretes Fast Recovery Diodes(FRD) FRD/SBD Modules
[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.
Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.
[Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.
[Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.